P.L. Tu
About
P.L. Tu has authored 14 papers that have received a total of 377 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (12 papers) and Advanced Welding Techniques Analysis (5 papers). P.L. Tu is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (12 papers) and Advanced Welding Techniques Analysis (5 papers) and collaborates with scholars based in Hong Kong and United States. P.L. Tu's co-authors include J.K.L. Lai, K.C. Hung, Y.C. Chan, Y.C. Chan and Chengcheng Tang and has published in prestigious journals such as Scripta Materialia, Materials Science and Engineering B and Microelectronics Reliability
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