Poi-Siong Teo

8 papers and 195 indexed citations i.

Poi-Siong Teo has authored 8 papers that have received a total of 195 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 1 paper in Materials Chemistry and 1 paper in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (4 papers) and Nanomaterials and Printing Technologies (3 papers). Poi-Siong Teo is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (4 papers) and Nanomaterials and Printing Technologies (3 papers) and collaborates with scholars based in Singapore and Ukraine. Poi-Siong Teo's co-authors include Subodh G. Mhaisalkar, E.H. Wong, Lay Kuan Teh, Freddy Boey and C.C. Wong and has published in prestigious journals such as Journal of Applied Physics, Thin Solid Films and Materials Science and Engineering B