Polina Snugovsky

22 papers and 270 indexed citations i.

Polina Snugovsky has authored 22 papers that have received a total of 270 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (8 papers). Polina Snugovsky is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (8 papers) and collaborates with scholars based in Canada, United States and United Kingdom. Polina Snugovsky's co-authors include D. D. Perović, J. W. Rutter, J.K. Spelt, Yan Qi and Michael J. Robinson and has published in prestigious journals such as JOM, Materials Science and Technology and Journal of Electronic Materials.