Przemyslaw Jakub Gromala

21 papers and 102 indexed citations i.

Przemyslaw Jakub Gromala has authored 21 papers that have received a total of 102 indexed citations. This includes 18 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers) and Advanced MEMS and NEMS Technologies (6 papers). Przemyslaw Jakub Gromala is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers) and Advanced MEMS and NEMS Technologies (6 papers) and collaborates with scholars based in Germany, United States and The Netherlands. Przemyslaw Jakub Gromala's co-authors include Bongtae Han, Guo Qi Zhang, Tobias Melz, Dirk Mayer and Daesuk Kim and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, Journal of Materials Science and Polymer Degradation and Stability.