Qiang Huang
About
Qiang Huang has authored 72 papers that have received a total of 711 indexed citations.
This includes 59 papers in Electrical and Electronic Engineering, 27 papers in Materials Chemistry and 19 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electrodeposition and Electroless Coatings (35 papers), Semiconductor materials and interfaces (16 papers) and Copper Interconnects and Reliability (14 papers). Qiang Huang is often cited by papers focused on Electrodeposition and Electroless Coatings (35 papers), Semiconductor materials and interfaces (16 papers) and Copper Interconnects and Reliability (14 papers) and collaborates with scholars based in United States, China and Germany. Qiang Huang's co-authors include Elizabeth J. Podlaha, Kathleen B. Reuter, L. T. Romankiw, Hariklia Deligianni and Marinus Hopstaken and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and The Journal of Physical Chemistry C.
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