Qingjun Cai
About
Qingjun Cai has authored 15 papers that have received a total of 642 indexed citations.
This includes 7 papers in Mechanical Engineering, 4 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. The topics of these papers are Heat Transfer and Boiling Studies (7 papers), Heat Transfer and Optimization (7 papers) and Electronic Packaging and Soldering Technologies (2 papers). Qingjun Cai is often cited by papers focused on Heat Transfer and Boiling Studies (7 papers), Heat Transfer and Optimization (7 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States, Australia and China. Qingjun Cai's co-authors include Chung-Lung Chen, Chia-Lun Tsai, Avijit Bhunia, Ya‐Chi Chen and Zhifeng Ren and has published in prestigious journals such as Applied Physics Letters, Carbon and International Journal of Heat and Mass Transfer
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