Qingke Zhang
About
Qingke Zhang has authored 60 papers that have received a total of 1.0k indexed citations.
This includes 48 papers in Mechanical Engineering, 34 papers in Electrical and Electronic Engineering and 17 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (33 papers), Advanced Welding Techniques Analysis (21 papers) and 3D IC and TSV technologies (16 papers). Qingke Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (33 papers), Advanced Welding Techniques Analysis (21 papers) and 3D IC and TSV technologies (16 papers) and collaborates with scholars based in China and United States. Qingke Zhang's co-authors include Lijing Yang, Hua Zou, Zhenlun Song, Xinglong Zhu and Fangqin Hu and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Materials Science and Engineering A
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