R. Mohr
About
R. Mohr has authored 5 papers that have received a total of 746 indexed citations.
This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Biomaterials and 2 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (2 papers), GaN-based semiconductor devices and materials (2 papers) and 3D IC and TSV technologies (2 papers). R. Mohr is often cited by papers focused on Electronic Packaging and Soldering Technologies (2 papers), GaN-based semiconductor devices and materials (2 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in Germany. R. Mohr's co-authors include André Zimmermann, Andreas Lendlein, H. Kück, Martin Moneke and Th. Weigel and has published in prestigious journals such as Proceedings of the National Academy of Sciences, IEEE Access and Smart Materials and Structures
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