R. Polastre

17 papers and 905 indexed citations i.

R. Polastre has authored 17 papers that have received a total of 905 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 5 papers in Mechanical Engineering and 3 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Heat Transfer and Optimization (5 papers). R. Polastre is often cited by papers focused on 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (5 papers) and Heat Transfer and Optimization (5 papers) and collaborates with scholars based in United States and Japan. R. Polastre's co-authors include Cornelia Tsang, S. L. Wright, John Knickerbocker, E. G. Colgan and R. Horton and has published in prestigious journals such as Journal of Applied Physics, IEEE Journal of Solid-State Circuits and Journal of Heat Transfer