R. Rajoo
About
R. Rajoo has authored 22 papers that have received a total of 308 indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 7 papers in Mechanics of Materials and 5 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (12 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). R. Rajoo is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (12 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers) and collaborates with scholars based in Singapore, United States and Taiwan. R. Rajoo's co-authors include E.H. Wong, Xiaowu Zhang, Cheryl Selvanayagam, Xiujuan Zhao and D. Pinjala and has published in prestigious journals such as Sensors and Actuators B Chemical, Journal of Applied Polymer Science and Journal of Electronic Materials
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