Rabih Khazaka
About
Rabih Khazaka has authored 22 papers that have received a total of 635 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 7 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Dielectric materials and actuators (6 papers) and 3D IC and TSV technologies (5 papers). Rabih Khazaka is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Dielectric materials and actuators (6 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in France. Rabih Khazaka's co-authors include Sombel Diaham, Marie‐Laure Locatelli, Pierre Bidan, David Henry and L. Mendizabal and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Power Electronics
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