R.F. Reidy
About
R.F. Reidy has authored 28 papers that have received a total of 466 indexed citations.
This includes 18 papers in Materials Chemistry, 9 papers in Electrical and Electronic Engineering and 9 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (8 papers), Silicone and Siloxane Chemistry (6 papers) and Aerogels and thermal insulation (6 papers). R.F. Reidy is often cited by papers focused on Copper Interconnects and Reliability (8 papers), Silicone and Siloxane Chemistry (6 papers) and Aerogels and thermal insulation (6 papers) and collaborates with scholars based in United States, Mexico and Italy. R.F. Reidy's co-authors include Brian P. Gorman, Hanjiang Dong, D. Mueller, Peter C. Collins and Casey Smith and has published in prestigious journals such as Nature Communications, Nano Letters and Journal of Applied Physics
In The Last Decade
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