Robert C. Pack
About
Robert C. Pack has authored 13 papers that have received a total of 268 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 6 papers in Automotive Engineering. The topics of these papers are Additive Manufacturing and 3D Printing Technologies (6 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Photolithography Techniques (3 papers). Robert C. Pack is often cited by papers focused on Additive Manufacturing and 3D Printing Technologies (6 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Advancements in Photolithography Techniques (3 papers) and collaborates with scholars based in United States and Singapore. Robert C. Pack's co-authors include Brett G. Compton, Nadim S. Hmeidat, Linyong Pang, Brian Dillon and Piyush Chandra Verma and has published in prestigious journals such as IEEE Transactions on Electron Devices, Additive manufacturing and JOM
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Robert C. Pack
260 citations, 12 papers
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