Rongmei Niu
About
Rongmei Niu has authored 44 papers that have received a total of 639 indexed citations.
This includes 27 papers in Materials Chemistry, 23 papers in Mechanical Engineering and 19 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Microstructure and mechanical properties (22 papers), Aluminum Alloys Composites Properties (16 papers) and Copper Interconnects and Reliability (9 papers). Rongmei Niu is often cited by papers focused on Microstructure and mechanical properties (22 papers), Aluminum Alloys Composites Properties (16 papers) and Copper Interconnects and Reliability (9 papers) and collaborates with scholars based in United States, China and Hong Kong. Rongmei Niu's co-authors include Ke Han, Engang Wang, Jun Lü, Yan Xin and Theo Siegrist and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Materials Science and Engineering A
In The Last Decade
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