Rung‐Ywan Tsai
About
Rung‐Ywan Tsai has authored 49 papers that have received a total of 1.1k indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 22 papers in Materials Chemistry and 13 papers in Biomedical Engineering. The topics of these papers are Nanoparticle-Based Drug Delivery (7 papers), Copper Interconnects and Reliability (6 papers) and Metal and Thin Film Mechanics (6 papers). Rung‐Ywan Tsai is often cited by papers focused on Nanoparticle-Based Drug Delivery (7 papers), Copper Interconnects and Reliability (6 papers) and Metal and Thin Film Mechanics (6 papers) and collaborates with scholars based in Taiwan and United States. Rung‐Ywan Tsai's co-authors include Mu‐Yi Hua, Hung‐Wei Yang, Hao-Li Liu, Shinn‐Tyan Wu and Cheng‐Keng Chuang and has published in prestigious journals such as Advanced Materials, ACS Nano and Applied Physics Letters
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