Ruyu Tian
About
Ruyu Tian has authored 24 papers that have received a total of 361 indexed citations.
This includes 20 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 4 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Ruyu Tian is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (11 papers) and Intermetallics and Advanced Alloy Properties (10 papers) and collaborates with scholars based in China, Hong Kong and Japan. Ruyu Tian's co-authors include Yanhong Tian, Liyou Zhao, Ninshu Ma, Ying Ding and Yilong Huang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Journal of Materials Processing Technology
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