Ryan J. Kershner
About
Ryan J. Kershner has authored 10 papers that have received a total of 451 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (3 papers), Electronic and Structural Properties of Oxides (2 papers) and Electronic Packaging and Soldering Technologies (2 papers). Ryan J. Kershner is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic and Structural Properties of Oxides (2 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in United States. Ryan J. Kershner's co-authors include Michael J. Cima, Ann R. Fornof, N. Jennifer, M. G. Lagally and Christine Micheel and has published in prestigious journals such as Nature Nanotechnology, Langmuir and Journal of Colloid and Interface Science
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Shyamal Kumar Mehetor are published in Top journals papers by Rachael C. Rigden are published in Top countries impacted by papers by Mohammad Pakdaman Top countries impacted by papers by Masami Fukahori Top journals papers by Elizabeth A. Turner are published in Top fields papers by Peter W. Kleeman are about Top journals papers by Yishang Zhang are published in Top journals papers by Faith T. Campbell are published in