S. Belyakov
About
S. Belyakov has authored 57 papers that have received a total of 1.1k indexed citations.
This includes 36 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 17 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloy Microstructure Properties (17 papers). S. Belyakov is often cited by papers focused on Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (17 papers) and Aluminum Alloy Microstructure Properties (17 papers) and collaborates with scholars based in United Kingdom, Japan and Latvia. S. Belyakov's co-authors include C.M. Gourlay, J.W. Xian, Hideyuki Yasuda, Zhaolong Ma and Kazuhiro Nogita and has published in prestigious journals such as Nature Communications, The Journal of Physical Chemistry B and Acta Materialia
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