S. Chéramy
About
S. Chéramy has authored 26 papers that have received a total of 124 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 5 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Semiconductor materials and devices (8 papers). S. Chéramy is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in France, Canada and United States. S. Chéramy's co-authors include Pascal Vivet, J. Michailos, P. Coudrain, Didier Lattard and P. Batude and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters and IEEE Transactions on Nuclear Science
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