S. Nitta
About
S. Nitta has authored 11 papers that have received a total of 178 indexed citations.
This includes 4 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 3 papers in Spectroscopy. The topics of these papers are Aerogels and thermal insulation (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Copper Interconnects and Reliability (2 papers). S. Nitta is often cited by papers focused on Aerogels and thermal insulation (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Copper Interconnects and Reliability (2 papers) and collaborates with scholars based in United States, Japan and China. S. Nitta's co-authors include Joel L. Plawsky, Peter Wayner, W. N. Gill, A. K. Jain and D. D. Gandhi and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Materials Science Materials in Medicine
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