S. Schmitz
About
S. Schmitz has authored 5 papers that have received a total of 107 indexed citations.
This includes 4 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Neurology. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Advanced Welding Techniques Analysis (2 papers). S. Schmitz is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (3 papers) and Advanced Welding Techniques Analysis (2 papers) and collaborates with scholars based in Germany and United States. S. Schmitz's co-authors include Martin Schneider‐Ramelow, K.-D. Lang, Ullrich Graeven, Roland J. Fuchs and Wolfram Klapper and has published in prestigious journals such as Leukemia and Microelectronics Reliability
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