S. W. Ricky Lee

131 papers and 1.9k indexed citations i.

S. W. Ricky Lee has authored 131 papers that have received a total of 1.9k indexed citations. This includes 83 papers in Electrical and Electronic Engineering, 36 papers in Mechanics of Materials and 35 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (57 papers), 3D IC and TSV technologies (39 papers) and GaN-based semiconductor devices and materials (14 papers). S. W. Ricky Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (57 papers), 3D IC and TSV technologies (39 papers) and GaN-based semiconductor devices and materials (14 papers) and collaborates with scholars based in Hong Kong, China and United States. S. W. Ricky Lee's co-authors include John H. Lau, Jeffery C. C. Lo, Xiaowu Zhang, Rong Zhang and Pin Tong and has published in prestigious journals such as Advanced Materials, Journal of Applied Physics and Advanced Functional Materials