Saptadeep Pal
About
Saptadeep Pal has authored 10 papers that have received a total of 85 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Computer Networks and Communications and 4 papers in Hardware and Architecture. The topics of these papers are 3D IC and TSV technologies (6 papers), Parallel Computing and Optimization Techniques (4 papers) and Electronic Packaging and Soldering Technologies (3 papers). Saptadeep Pal is often cited by papers focused on 3D IC and TSV technologies (6 papers), Parallel Computing and Optimization Techniques (4 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in United States. Saptadeep Pal's co-authors include Puneet Gupta, Subramanian S. Iyer, Adeel Bajwa and Mark S. Goorsky and has published in prestigious journals such as IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Micro and ACM Transactions on Design Automation of Electronic Systems
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