Sathyanarayanan Raghavan
About
Sathyanarayanan Raghavan has authored 6 papers that have received a total of 433 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 4 papers in Mechanics of Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Mechanical Behavior of Composites (3 papers) and 3D IC and TSV technologies (2 papers). Sathyanarayanan Raghavan is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Mechanical Behavior of Composites (3 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in United States, Hong Kong and South Korea. Sathyanarayanan Raghavan's co-authors include Suresh K. Sitaraman, Kyoung‐sik Moon, K. Klein and Ching‐Ping Wong and has published in prestigious journals such as ACS Applied Materials & Interfaces, Engineering Fracture Mechanics and IEEE Transactions on Device and Materials Reliability.
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