Scott Irving
About
Scott Irving has authored 5 papers that have received a total of 87 indexed citations.
This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (2 papers) and Engineering Structural Analysis Methods (1 paper). Scott Irving is often cited by papers focused on Electronic Packaging and Soldering Technologies (3 papers), 3D IC and TSV technologies (2 papers) and Engineering Structural Analysis Methods (1 paper) and collaborates with scholars based in United States, Australia and China. Scott Irving's co-authors include Timwah Luk and Yinong Liu and has published in prestigious journals such as International Journal of Heat and Fluid Flow, Microelectronics Reliability and Engineering Failure Analysis
In The Last Decade
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