Seok‐Hwan Huh
About
Seok‐Hwan Huh has authored 45 papers that have received a total of 1.2k indexed citations.
This includes 21 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 15 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Magnetic and transport properties of perovskites and related materials (10 papers) and 3D IC and TSV technologies (7 papers). Seok‐Hwan Huh is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Magnetic and transport properties of perovskites and related materials (10 papers) and 3D IC and TSV technologies (7 papers) and collaborates with scholars based in South Korea, India and Saudi Arabia. Seok‐Hwan Huh's co-authors include Kavita Kumari, Katsuaki Suganuma, Bon Heun Koo, Keun‐Soo Kim and Shalendra Kumar and has published in prestigious journals such as Journal of The Electrochemical Society, Carbohydrate Polymers and Journal of the American Ceramic Society
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