Seung‐Boo Jung
About
Seung‐Boo Jung has authored 409 papers that have received a total of 8.0k indexed citations.
This includes 318 papers in Electrical and Electronic Engineering, 226 papers in Mechanical Engineering and 51 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (274 papers), 3D IC and TSV technologies (213 papers) and Advanced Welding Techniques Analysis (134 papers). Seung‐Boo Jung is often cited by papers focused on Electronic Packaging and Soldering Technologies (274 papers), 3D IC and TSV technologies (213 papers) and Advanced Welding Techniques Analysis (134 papers) and collaborates with scholars based in South Korea, Australia and United States. Seung‐Boo Jung's co-authors include Jeong‐Won Yoon, Bo‐In Noh, Jong‐Woong Kim, Yun-Mo Yeon and Don-Hyun Choi and has published in prestigious journals such as Journal of The Electrochemical Society, Scientific Reports and ACS Applied Materials & Interfaces
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