S.H. Shi

6 papers and 172 indexed citations i.

S.H. Shi has authored 6 papers that have received a total of 172 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 1 paper in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Epoxy Resin Curing Processes (4 papers) and 3D IC and TSV technologies (4 papers). S.H. Shi is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Epoxy Resin Curing Processes (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States. S.H. Shi's co-authors include C.P. Wong, George Jefferson and Yang Rao and has published in prestigious journals such as Journal of Applied Polymer Science, IEEE Transactions on Components and Packaging Technologies and IEEE Transactions on Components Packaging and Manufacturing Technology Part A