Shenghao Yang
About
Shenghao Yang has authored 17 papers that have received a total of 529 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 6 papers in Materials Chemistry. The topics of these papers are Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and 3D IC and TSV technologies (5 papers). Shenghao Yang is often cited by papers focused on Intermetallics and Advanced Alloy Properties (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in Taiwan, United States and Canada. Shenghao Yang's co-authors include C. R. Kao, S.K. Wu, Ren-Kae Shiue, W. Graupner and S. C. Ray and has published in prestigious journals such as Applied Physics Letters, Journal of Alloys and Compounds and Scripta Materialia
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