Shinichi Ogawa
About
Shinichi Ogawa has authored 115 papers that have received a total of 2.0k indexed citations.
This includes 68 papers in Electrical and Electronic Engineering, 36 papers in Electronic, Optical and Magnetic Materials and 29 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (34 papers), Semiconductor materials and devices (22 papers) and Electronic Packaging and Soldering Technologies (22 papers). Shinichi Ogawa is often cited by papers focused on Copper Interconnects and Reliability (34 papers), Semiconductor materials and devices (22 papers) and Electronic Packaging and Soldering Technologies (22 papers) and collaborates with scholars based in Japan, United States and Germany. Shinichi Ogawa's co-authors include R. G. Shulman, Paul S. Ho, Ehrenfried Zschech, Shu Nakaharai and Takuya Iwasaki and has published in prestigious journals such as Nature, Science and Proceedings of the National Academy of Sciences
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