Shinichi Ogawa

31 papers and 168 indexed citations i.

Shinichi Ogawa has authored 31 papers that have received a total of 168 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 9 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (8 papers) and 3D IC and TSV technologies (6 papers). Shinichi Ogawa is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Copper Interconnects and Reliability (8 papers) and 3D IC and TSV technologies (6 papers) and collaborates with scholars based in Japan, United States and Germany. Shinichi Ogawa's co-authors include Paul S. Ho, Ehrenfried Zschech, Rui Huang, Xuefeng Zhang and Takaaki Ohtake and has published in prestigious journals such as Journal of Applied Physics, Journal of Membrane Science and IEEE Transactions on Electron Devices