Shiqian Liu
About
Shiqian Liu has authored 18 papers that have received a total of 304 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Aluminum Alloys Composites Properties (4 papers). Shiqian Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (8 papers) and Aluminum Alloys Composites Properties (4 papers) and collaborates with scholars based in China, Australia and Japan. Shiqian Liu's co-authors include Stuart D. McDonald, Kazuhiro Nogita, Qinfen Gu, Syo Matsumura and Dongdong Qu and has published in prestigious journals such as ACS Applied Materials & Interfaces, Environmental Pollution and Journal of Alloys and Compounds
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