Shuqi Liang

21 papers and 272 indexed citations i.

Shuqi Liang has authored 21 papers that have received a total of 272 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 6 papers in Water Science and Technology. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (10 papers) and Copper Interconnects and Reliability (7 papers). Shuqi Liang is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (10 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in China, Taiwan and United States. Shuqi Liang's co-authors include Chih Chen, Wensheng Wang, Dan Zhang, Gangfeng Ouyang and Guoqing Wang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemical Communications