Siming Pan
About
Siming Pan has authored 29 papers that have received a total of 293 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 4 papers in Aerospace Engineering and 3 papers in Computer Networks and Communications. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (18 papers), 3D IC and TSV technologies (11 papers) and Electronic Packaging and Soldering Technologies (5 papers). Siming Pan is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (18 papers), 3D IC and TSV technologies (11 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, Hong Kong and China. Siming Pan's co-authors include Jun Fan, Jingook Kim, James L. Drewniak, D.E. Dodds and Bruce Archambeault and has published in prestigious journals such as IEEE Transactions on Communications, IEEE Transactions on Antennas and Propagation and Journal of Optimization Theory and Applications
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