Sony Mathew

14 papers and 376 indexed citations i.

Sony Mathew has authored 14 papers that have received a total of 376 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 2 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and 3D IC and TSV technologies (3 papers). Sony Mathew is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in United States, United Kingdom and Hong Kong. Sony Mathew's co-authors include Michael Pecht, Michael Osterman, Hamid Seddighi, Diganta Das and Tong Fang and has published in prestigious journals such as Journal of Power Sources, Microelectronics Reliability and IEEE Transactions on Device and Materials Reliability