Soon Wee Ho

23 papers and 220 indexed citations i.

Soon Wee Ho has authored 23 papers that have received a total of 220 indexed citations. This includes 23 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (15 papers) and Microwave Engineering and Waveguides (6 papers). Soon Wee Ho is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (15 papers) and Microwave Engineering and Waveguides (6 papers) and collaborates with scholars based in Singapore, Taiwan and China. Soon Wee Ho's co-authors include Xiaowu Zhang, John H. Lau, Dong Kyun Sohn, D. Pinjala and Teck Guan Lim and has published in prestigious journals such as IEEE Transactions on Electron Devices, Microelectronics Reliability and IEEE Transactions on Components Packaging and Manufacturing Technology