Suk-Kyu Ryu
About
Suk-Kyu Ryu has authored 11 papers that have received a total of 488 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (10 papers), Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). Suk-Kyu Ryu is often cited by papers focused on 3D IC and TSV technologies (10 papers), Chemical Mechanical Polishing in Microelectronics Manufacturing (8 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States. Suk-Kyu Ryu's co-authors include Paul S. Ho, Rui Huang, Jay Im, Kuan Lu and Tengfei Jiang and has published in prestigious journals such as Applied Physics Letters and IEEE Transactions on Device and Materials Reliability
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