Sungdong Kim
About
Sungdong Kim has authored 34 papers that have received a total of 2.5k indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 9 papers in Materials Chemistry and 6 papers in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (11 papers) and ZnO doping and properties (7 papers). Sungdong Kim is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (11 papers) and ZnO doping and properties (7 papers) and collaborates with scholars based in South Korea, The Netherlands and United States. Sungdong Kim's co-authors include Sarah Eunkyung Kim, Minjae Lee, Cheol Kim, Joseph Um and Younghak Cho and has published in prestigious journals such as Bioinformatics, Journal of Applied Physics and Applied Surface Science
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