Sze Pei Lim

11 papers and 38 indexed citations i.

Sze Pei Lim has authored 11 papers that have received a total of 38 indexed citations. This includes 11 papers in Electrical and Electronic Engineering, 1 paper in Biomedical Engineering and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). Sze Pei Lim is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (10 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers) and collaborates with scholars based in Japan, United States and India. Sze Pei Lim's co-authors include Eric Kuah, Kai Wu, Ming Li, Rozalia Beica and John H. Lau and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology