T. Bolom
About
T. Bolom has authored 14 papers that have received a total of 620 indexed citations.
This includes 10 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 7 papers in Mechanics of Materials. The topics of these papers are Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (7 papers) and Copper Interconnects and Reliability (7 papers). T. Bolom is often cited by papers focused on Semiconductor materials and devices (9 papers), Metal and Thin Film Mechanics (7 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in United States, Germany and Switzerland. T. Bolom's co-authors include K. Moto, Pavel Nesládek, S. Vepřek, P. Flaitz and John G. Ekerdt and has published in prestigious journals such as Applied Physics Letters, Thin Solid Films and Japanese Journal of Applied Physics
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