T. David

53 papers and 792 indexed citations i.

T. David has authored 53 papers that have received a total of 792 indexed citations. This includes 20 papers in Mechanical Engineering, 17 papers in Electrical and Electronic Engineering and 13 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (12 papers) and Injection Molding Process and Properties (8 papers). T. David is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (12 papers) and Injection Molding Process and Properties (8 papers) and collaborates with scholars based in Ireland, France and United Kingdom. T. David's co-authors include T. Chevolleau, N. Possémé, Maxime Darnon, O. Joubert and Richard Sherlock and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Renewable and Sustainable Energy Reviews