T. Dishongh
About
T. Dishongh has authored 10 papers that have received a total of 233 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanics of Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Adhesion, Friction, and Surface Interactions (2 papers). T. Dishongh is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (4 papers) and Adhesion, Friction, and Surface Interactions (2 papers) and collaborates with scholars based in United States. T. Dishongh's co-authors include Cemal Basaran, Yuliang Zhao, Alexander N. Cartwright, Dereje Agonafer and J.L. Prince and has published in prestigious journals such as Journal of Applied Physics, Journal of Biomedical Materials Research and Mechanics of Materials
In The Last Decade
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