T. Kangasvieri
About
T. Kangasvieri has authored 27 papers that have received a total of 302 indexed citations.
This includes 27 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Electrical and Thermal Properties of Materials (10 papers). T. Kangasvieri is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Electrical and Thermal Properties of Materials (10 papers) and collaborates with scholars based in Finland and Australia. T. Kangasvieri's co-authors include Jouko Vähäkangas, R. Rautioaho, Heli Jantunen, Markku Lahti and Kari Kautio and has published in prestigious journals such as Journal of the European Ceramic Society, Electronics Letters and Journal of Electronic Materials
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Mehmet Gümüş are published in Top authors papers by Peter Holstein are co-authored with Top fields papers by Yué Zeng are about Top countries impacted by papers by Hina Shoukat Top authors papers by Li Yin are co-authored with Top countries impacted by papers by C. R. Coombs Top fields papers by Jane Fleming are about Top fields papers by Chao Gu are about