T. Kangasvieri

27 papers and 302 indexed citations i.

T. Kangasvieri has authored 27 papers that have received a total of 302 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Electrical and Thermal Properties of Materials (10 papers). T. Kangasvieri is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (17 papers) and Electrical and Thermal Properties of Materials (10 papers) and collaborates with scholars based in Finland and Australia. T. Kangasvieri's co-authors include Jouko Vähäkangas, R. Rautioaho, Heli Jantunen, Markku Lahti and Kari Kautio and has published in prestigious journals such as Journal of the European Ceramic Society, Electronics Letters and Journal of Electronic Materials