T. Lacrevaz

24 papers and 107 indexed citations i.

T. Lacrevaz has authored 24 papers that have received a total of 107 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 5 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (9 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (9 papers). T. Lacrevaz is often cited by papers focused on 3D IC and TSV technologies (9 papers), Copper Interconnects and Reliability (9 papers) and Semiconductor materials and devices (9 papers) and collaborates with scholars based in France, Switzerland and Hungary. T. Lacrevaz's co-authors include C. Bermond, B. Fléchet, A. Farcy, Trinh Vo and J. Torrès and has published in prestigious journals such as Applied Physics Letters, Microelectronic Engineering and Microwave and Optical Technology Letters