T. M. Tsai
About
T. M. Tsai has authored 21 papers that have received a total of 328 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 18 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (3 papers). T. M. Tsai is often cited by papers focused on Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (17 papers) and Metal and Thin Film Mechanics (3 papers) and collaborates with scholars based in Taiwan, China and United States. T. M. Tsai's co-authors include Po‐Tsun Liu, Y. S. Mor, Simon M. Sze, C. W. Chen and Tien–Chun Chang and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Thin Solid Films
In The Last Decade
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