T. Nishimura

17 papers and 382 indexed citations i.

About

T. Nishimura has authored 17 papers that have received a total of 382 indexed citations. This includes 10 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (5 papers). T. Nishimura is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (7 papers) and Aluminum Alloy Microstructure Properties (5 papers) and collaborates with scholars based in Japan, United Kingdom and Australia. T. Nishimura's co-authors include C.M. Gourlay, Kazuhiro Nogita, S. Belyakov, A. K. Dahle and Jingwei Xian and has published in prestigious journals such as Nature Communications, The Astrophysical Journal and Journal of Applied Physics.

In The Last Decade

Fields of papers published by T. Nishimura

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by T. Nishimura

Since Specialization
Citations
Rankless by CCL
2025