T. Tilford

28 papers and 133 indexed citations i.

T. Tilford has authored 28 papers that have received a total of 133 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 5 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (6 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers). T. Tilford is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (6 papers) and Additive Manufacturing and 3D Printing Technologies (5 papers) and collaborates with scholars based in United Kingdom, Germany and Malaysia. T. Tilford's co-authors include C. Bailey, Marc P. Y. Desmulliez, Alan Sangster, Stoyan Stoyanov and George Goussetis and has published in prestigious journals such as IEEE Transactions on Industrial Electronics, IEEE Access and IEEE Transactions on Microwave Theory and Techniques