Tae Sung Oh

70 papers and 1.1k indexed citations i.

Tae Sung Oh has authored 70 papers that have received a total of 1.1k indexed citations. This includes 39 papers in Materials Chemistry, 37 papers in Electrical and Electronic Engineering and 19 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (19 papers), Advanced Thermoelectric Materials and Devices (17 papers) and 3D IC and TSV technologies (14 papers). Tae Sung Oh is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), Advanced Thermoelectric Materials and Devices (17 papers) and 3D IC and TSV technologies (14 papers) and collaborates with scholars based in South Korea, United States and Australia. Tae Sung Oh's co-authors include Dow‐Bin Hyun, S. P. Kowalczyk, Ji Young Byun, Jae Ho Lee and Joung Yoon Choi and has published in prestigious journals such as Journal of the American Ceramic Society, Journal of Materials Science and Scripta Materialia