Tae-Sung Oh
About
Tae-Sung Oh has authored 50 papers that have received a total of 658 indexed citations.
This includes 32 papers in Materials Chemistry, 31 papers in Electrical and Electronic Engineering and 15 papers in Mechanical Engineering. The topics of these papers are Advanced Thermoelectric Materials and Devices (24 papers), Electronic Packaging and Soldering Technologies (13 papers) and 3D IC and TSV technologies (11 papers). Tae-Sung Oh is often cited by papers focused on Advanced Thermoelectric Materials and Devices (24 papers), Electronic Packaging and Soldering Technologies (13 papers) and 3D IC and TSV technologies (11 papers) and collaborates with scholars based in South Korea, Australia and Japan. Tae-Sung Oh's co-authors include Minyoung Kim, Kwang-Yong Lee, Jaehwan Kim, Hyojung Bae and Hyojong Lee and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Materials Science and Scripta Materialia
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